tsml1000, tsml1020, TSML1030, tsml1040 www.vishay.com vishay semiconductors rev. 2.0, 30-jun-11 1 document number: 81033 for technical questions, contact: emittertechsupport@vishay.com this document is subject to change without notice. the products described herein and this document are subject to specific disclaimers, set forth at www.vishay.com/doc?91000 high power infrared emitting diode, rohs compliant, 940 nm, gaalas/gaas description tsml1000 is an infrared, 940 nm emitting diode in gaalas/gaas with high radiant power molded in a clear, untinted plastic package (with lens) for surface mounting (smd). features ? package type: surface mount ? package form: gw, rgw, yoke, axial ? dimensions (l x w x h in mm): 2.5 x 2 x 2.7 ? peak wavelength: ? p = 940 nm ? high radiant power ? high radiant intensity ? angle of half intensity: ? = 12 ? low forward voltage ? suitable for high pulse current operation ? good spectral matching with si photodetectors ? versatile terminal configurations ? package matches with detector temt1000 ? floor life: 168 h, msl 3, acc. j-std-020 ? compliant to rohs directive 2002/95/ec and in accordance with weee 2002/96/ec applications ? for remote control ? punched tape readers ?encoder ? photointerrupters note ? test conditions see table basic characteristics note ? moq: minimum order quantity 16852 tsml1000 TSML1030 tsml1040 tsml1020 product summary component i e (mw/sr) ? (deg) ? p (nm) t r (ns) tsml1000 7 12 940 800 tsml1020 7 12 940 800 TSML1030 7 12 940 800 tsml1040 7 12 940 800 ordering information ordering code packaging remarks package form tsml1000 tape and reel moq: 1000 pcs, 1000 pcs/reel re verse gullwing tsml1020 tape and reel moq: 1000 pcs, 1000 pcs/reel gullwing TSML1030 tape and reel moq: 1000 pcs, 1000 pcs/reel yoke tsml1040 bulk moq: 1000 pcs, 1000 pcs/bulk axial leads
tsml1000, tsml1020, TSML1030, tsml1040 www.vishay.com vishay semiconductors rev. 2.0, 30-jun-11 2 document number: 81033 for technical questions, contact: emittertechsupport@vishay.com this document is subject to change without notice. the products described herein and this document are subject to specific disclaimers, set forth at www.vishay.com/doc?91000 fig. 1 - power dissipation limit vs . ambient temperature fig. 2 - forward current vs. ambient temperature absolute maximum ratings (t amb = 25 c, unless otherwise specified) parameter test condition symbol value unit reverse voltage v r 5v forward current i f 100 ma peak forward current t p /t = 0.5, t p ? 100 s i fm 200 ma surge forward current t p = 100 s i fsm 1.0 a power dissipation p v 190 mw junction temperature t j 100 c operating temperature range t amb - 40 to + 85 c storage temperature range t stg - 40 to + 100 c soldering temperature t ? 5 s t sd < 260 c thermal resistance junction/ambient soldered on pcb, pad dimensions: 4 mm x 4 mm r thja 400 c p - power dissipation (mw) v 0 20 40 60 80 100 120 140 160 180 200 t amb - ambient temperature (c) 16187 100 90 80 70 60 50 40 30 20 10 0 0 20 40 60 80 100 120 16188 i f - forward current (ma) 0 t amb - ambient temperature (c) 90 80 70 60 50 40 30 20 10 100 basic characteristics (t amb = 25 c, unless otherwise specified) parameter test condition symbol min. typ. max. unit for w ard voltage i f = 20 ma, t p = 20 ms v f 1.2 1.5 v i f = 1 a, t p = 100 s v f 2.6 v temperature coefficient of v f i f = 1 ma tk vf - 1.8 mv/k reverse c u rrent v r = 5 v i r 10 a j u nction capacitance v r = 0 v, f = 1 mhz, e = 0 c j 25 pf radiant intensity i f = 20 ma, t p = 20 ms i e 3715mw/sr radiant po w er i f = 100 ma, t p = 20 ms ? e 35 mw temperature coefficient of ? e i f = 20 ma tk ? e - 0.6 %/k angle of half intensity ? 12 deg peak w avelength i f = 100 ma ? p 940 nm spectral b and w idth i f = 100 ma ?? 50 nm temperature coefficient of ? p i f = 100 ma tk ? p 0.2 nm/k rise time i f = 100 ma t r 800 ns fall time i f = 100 ma t f 800 ns v irt u al so u rce diameter d1.2mm
tsml1000, tsml1020, TSML1030, tsml1040 www.vishay.com vishay semiconductors rev. 2.0, 30-jun-11 3 document number: 81033 for technical questions, contact: emittertechsupport@vishay.com this document is subject to change without notice. the products described herein and this document are subject to specific disclaimers, set forth at www.vishay.com/doc?91000 basic characteristics (t amb = 25 c, unless otherwise specified) fig. 3 - pulse forward current vs. pulse duration fig. 4 - forward current vs. forward voltage fig. 5 - radiant intensity vs. forward current fig. 6 - radiant power vs. forward current fig. 7 - relative radiant intens ity/power vs. ambient temperature fig. 8 - relative radi ant power vs. wavelength 10 100 1000 10 000 0.01 0.10 1.00 10.00 100.00 t p - pulse duration (ms) 14335 i - forward current (ma) f t p / t = 0.01 0.05 0.2 0.5 1.0 0.1 0.02 v f - forward voltage (v) 13600 10 1 10 0 10 2 10 3 10 4 t p = 100 s t p /t = 0.001 0 i f - forward current (ma) 4 3 2 1 16189 10 3 10 1 10 2 10 4 10 0 0.1 1 10 1000 100 i f - forward current (ma) i e - radiant intensity (mw/sr) - radiant power (mw) e i f - forward current (ma) 13602 10 3 10 1 10 2 10 4 10 0 0.1 1 10 1000 100 - 10 10 50 0 100 0 0.4 0.8 1.2 1.6 i e rel ; 140 94 7993 i f = 20 ma e rel t amb - ambient temperature (c) 890 0 0.25 0.5 0.75 1.0 1.25 - wa v elength (nm) 14291 - relati v e radiant power e rel i f = 100 ma 990 940
tsml1000, tsml1020, TSML1030, tsml1040 www.vishay.com vishay semiconductors rev. 2.0, 30-jun-11 4 document number: 81033 for technical questions, contact: emittertechsupport@vishay.com this document is subject to change without notice. the products described herein and this document are subject to specific disclaimers, set forth at www.vishay.com/doc?91000 fig. 9 - relative radiant in tensity vs. angular displacement precautions for use 1. over-current-proof customer must apply resistor s for protection, otherwise slight voltage shift will cause big current change (burn out will happen). 2. storage 2.1 storage temperat u re and rel. h u midity conditions are: 5 c to 35 c, r.h. 60 %. 2.2 floor life m u st not exceed 16 8 h, acc. to jedec level 3, j-std-020. once the package is opened, the prod u cts sho u ld b e u sed w ithin a w eek. other w ise, they sho u ld b e kept in a damp proof b ox w ith desiccant. considering tape life, w e s u ggest to u se prod u cts w ithin one year from prod u ction date. 2.3 if opened more than one w eek in an atmosphere 5 c to 35 c, r.h. 60 %, devices sho u ld b e treated at 60 c 5 c for 15 h. 2.4 if h u midity indicator in the package sho w s pink color (normal b l u e), then devices sho u ld b e treated w ith the same conditions as 2.3. reflow solder profile fig. 10 - lead tin (snpb) reflow solder profile fig. 11 - lead (pb)-free reflow solder profile acc. j-std-020 i e rel - relati v e intensity 18234 0.6 0.9 0.8 0 30 10 20 40 50 60 70 80 0.7 1.0 0.6 0.4 0.2 0 0.2 0.4 60 80 100 120 140 160 180 200 220 240 260 0 20 40 60 80 100 120 140 160 180 200 220 time (s) temperature (c) 17172 + 5 c/s 5 s 60 s to 120 s - 5 c/s 22566 120 s max. 60 s max. abo v e 220 c 260 c max. 10 s max. pre-heating 180 c to 200 c 1 c/s to 5 c/s 1 c/s to 5 c/s
tsml1000, tsml1020, TSML1030, tsml1040 www.vishay.com vishay semiconductors rev. 2.0, 30-jun-11 5 document number: 81033 for technical questions, contact: emittertechsupport@vishay.com this document is subject to change without notice. the products described herein and this document are subject to specific disclaimers, set forth at www.vishay.com/doc?91000 package dimensions in millimeters: tsml1000 package dimensions in millimeters: tsml1020 16159 16160 3.8 0.2 ? 1.9 0.2 0.3 0.15 0.05 0.75 1.4 2.7 0.2 0.85 2.5 0.2 1.1 2 0.2 0.5 0.4 ca 4.5 0.1 2.3 0.1 1 0.1
tsml1000, tsml1020, TSML1030, tsml1040 www.vishay.com vishay semiconductors rev. 2.0, 30-jun-11 6 document number: 81033 for technical questions, contact: emittertechsupport@vishay.com this document is subject to change without notice. the products described herein and this document are subject to specific disclaimers, set forth at www.vishay.com/doc?91000 package dimensions in millimeters: TSML1030 package dimensions in millimeters: tsml1040 16228 16760
tsml1000, tsml1020, TSML1030, tsml1040 www.vishay.com vishay semiconductors rev. 2.0, 30-jun-11 7 document number: 81033 for technical questions, contact: emittertechsupport@vishay.com this document is subject to change without notice. the products described herein and this document are subject to specific disclaimers, set forth at www.vishay.com/doc?91000 reel dimensions in millimeters taping dimensions in millimeters: tsml1000 issue: 3; 11.06.08 drawing-no.: 9.800-5080.01-4 leader and trailer tape: parts mounted empty trailer (200 mm, min.) empty leader (400 mm, min.) direction of pulling out unreel direction 60.2 0.5 178 1 2 . 5 0.5 label posted here coming out from reel tape position x x 13 0.5 13.2 1.5 16 0.2 18033 18030 3.05 0.1 0.3 ? 1.55 0.05 4 0.1 2 0.05 4 0.1 1.75 0.1 5.5 0.05 12 0.3 top tape push pin through hole quantity per reel: 1000 pcs or 5000 pcs feed direction anode
tsml1000, tsml1020, TSML1030, tsml1040 www.vishay.com vishay semiconductors rev. 2.0, 30-jun-11 8 document number: 81033 for technical questions, contact: emittertechsupport@vishay.com this document is subject to change without notice. the products described herein and this document are subject to specific disclaimers, set forth at www.vishay.com/doc?91000 taping dimensions in millimeters: tsml1020 taping dimensions in millimeters: TSML1030 18031 3.05 0.1 0.3 ? 1.55 0.05 4 0.1 2 0.05 4 0.1 1.75 0.1 5.5 0.05 12 0.3 top tape push pin through hole quantity per reel: 1000 pcs or 5000 pcs feed direction anode 18032 3.05 0.1 0.3 ? 1.55 0.05 4 0.1 2 0.05 4 0.1 1.75 0.1 5.5 0.05 12 0.3 top tape push pin through hole quantity per reel: 1000 pcs or 5000 pcs feed direction anode
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